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Malaysia
The PIE (package integration engineering) Engineer, in close collaboration with Multi-functional Groups (TPM/PMO-BU, TD, DESIGN, CEM, Site Engineering), is responsible for the effective and efficient execution of new product transfer from NPN (new product notification) to high volume manufacturing.
The success of this position will be assessed by the timely BU project timeline readiness for DC/ES/QS/Stick build, first time & on time package Qual release and the ability to ramp the product to minimum, predefined yield and quality targets from NPI-LVM and meeting 100% of handover criteria.
Key responsibilities and task:
About Us:
Micron is a world leader in innovative memory solutions that transform how the world uses information.
We have over 34,000 team members in 17 countries who work with the world’s most trusted brands, delivering memory and storage systems for a broad range of applications and sparking countless possibilities in technology.
Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.